Product Overview
GET Engineering is proud to announce its new MIL‑STD‑188‑203‑1A (ATDS) Conduction Cooled Interface Adapter fully compliant to the ANSI/VITA‑20‑2001 Conduction Cooled PMC Standard. This adapter provides a TADIL‑A Serial Interface functioning either as a Data Terminal Set (DTS) or Terminal Data System (TDS). All configuration parameters are accessible through a simple software interface with FPGA‑controlled DMA channels to reduce host CPU overhead.
GET Engineering’s ATDS card is available in either commercial or extended temperature ranges with the option of either front panel (Micro‑D 25 pin) or rear (P4) I/O. The software included with this adapter card provides the user with an operating system independent API enabling easy migration from one operating system to another; for example, from Windows XP to Linux.
Key Features
Common API across multiple operating systems
Memory Mapped Address Space
Independent FPGA‑controlled DMA Channels
Extensive Built‑in‑Test capabilities enable rapid troubleshooting of interface
Sample code provided for rapid Application Code Development
Optional Time Stamping on data transactions
Key Hardware Features
Front I/O - Part Number 10076301-S-BPC-I
Rear I/O - Part Number 10076301-S-RP-I
ANSI/VITA 20‑2001 compliant PMC Module
Data Frames of 13.33 or 22 milliseconds
Supports Picket Addressing and Sidetone
User controlled Front Panel LED for Adapter Status Command and Inter‑word time‑outs
Front or Rear Panel (P4) I/O configurations available
| Specifications | |
|---|---|
| ATDS Interface | Full Compliance to MIL‑STD‑188‑203‑1A, Appendix D2 |
| Form Factor | ANSI/Vita 20‑2001 Standard Single CCPMC Card Module(74 mm x 143.77 mm) |
| Bus Interface | IEEE 1386.1‑2002 Standard for common mezzanine card family |
| Power Requirements | 3.5 Watts |
| I/O Connections: Front Panel | Micro‑D‑Subminiature 25‑pin plug (MIL‑STD‑83513 optional) |
| I/O Connections: Rear Panel (P4) | P4 I/O per ANSI/VITA‑35‑2001 |
| Temperature Standard | 0°C to 55°C Operating (MIL‑STD‑810, Method 501 and 502, Procedure II) |
| Extended Temperature Version | -40°C to 85°C Operating (ANSI/VITA 47, Class CC4) |
| Storage Temperature | -40°C to 85°C Operating (MIL‑STD‑810, Method 501 and 502 Procedure I) |
| Humidity | 5 to 95% humidity operational (non‑condensing) (MIL‑STD‑810, Method 507) |
| Vibration | 0.01g²/Hz 15–2KHz, Optional 0.1g²/Hz 15–2KHz (MIL‑STD‑810, Method 514, Procedure I) |
| Operating Shock | 20 g peak, Optional 40 g peak (MIL‑STD‑810, Method 516, Procedure I) |
| Mean Time Between Failures | Greater than 200K hours MTBF per MIL‑HDBK‑217, Revision E, 25°C Ground Benign Environment |